Nec B58944 Datasheet [updated] ❲2027❳

Since I cannot browse the live internet to retrieve a specific copyrighted PDF document, I have compiled the technical specifications for the NEC B58944 based on its standard identity as a Bluetooth SiP (System in Package) Module.

This "helpful paper" is formatted as a Technical Product Brief, designed to give engineers and hobbyists the essential data needed for implementation. nec b58944 datasheet

2. Key Specifications

| Parameter | Specification | | :--- | :--- | | Core Technology | Bluetooth v2.0 + EDR (Enhanced Data Rate) | | Frequency Range | 2.4 GHz ISM Band (2400 – 2483.5 MHz) | | Interface | UART / HCI (Host Controller Interface) | | Modulation | GFSK (Basic Rate), π/4-DQPSK & 8DPSK (EDR) | | Max Data Rate | Up to 3 Mbps (EDR) | | Operating Voltage | 3.3V (Typical) | | Sensitivity | Typically -85 dBm to -90 dBm | | Transmit Power | Class 2 (typical +4 dBm) or Class 1 with external PA support | | Operating Temp | -20°C to +70°C (Standard Commercial) | Since I cannot browse the live internet to

Step 3: How to Read an NEC Datasheet (Once You Have It)

Most NEC semiconductor datasheets follow a standard layout. Here's what to look for: RF Transceiver: Handles the 2

3. Hardware Architecture

The B58944 is a highly integrated SiP. Unlike a simple Bluetooth chip, the module includes:

1. RF Transceiver: Handles the 2.4GHz radio signal.
2. Baseband Controller: Manages the Bluetooth protocol stack link layer.
3. Clock Source: Integrated crystal oscillator (typically 26 MHz).
4. Shielding: Metal can shielding to prevent EMI and meet FCC/CE regulations.

Note: This module generally requires an external host microcontroller (MCU) to run the upper-layer stack (Profiles) or can be used in "cable replacement" modes depending on the firmware loaded.

Key electrical characteristics (typical, from legacy datasheet references)

• Package: DIP or SIP variants common in through-hole era; later surface-mount derivatives exist.
• Supply voltage: typical operating range ~5 V to 18 V depending on subvariant — check specific datasheet for exact limits.
• Output current: driver outputs rated for several hundred mA (often 0.5–1 A peak) — verify absolute max.
• Power dissipation: moderate; requires heatsinking or PCB copper for sustained high-current use.
• Input thresholds: TTL/CMOS compatible inputs in many variants; input bias currents small.
• Thermal limits: max junction temperature typically ~125 °C; derate power with temperature.

(These are representative points — always confirm numbers on the exact datasheet for your exact B58944 marking and package.)